Quality control on the fly: Alloy identification on-site using handheld XRF and LIBS analysersWednesday (08.11.2017) 15:40 - 16:00 Part of:
For reliable material identification, a precise analysis of alloy constituents is essential. Handheld devices allow a fast analysis at any place of interest.
Currently two different technologies for alloy characterization by handheld analyzers are available on the market.
The X-ray fluorescence (XRF) method is a long-established technique for mobile analyzers. The benefits of this method are the accuracy and the nondestructive quantification of elements independently of alloying base. In simplified terms electrons are removed from the inner shells by the primary X-radiation and the outcoming gap is filled with electrons from outer shells. The energetic difference results in element characteristic fluorescence radiation which is recorded by a Si-Pin or Si-Drift detector (SDD). Thereby a wide range of elements (Mg (12) to Ur (92)) can be identified.
On the other hand with laser-induced breakdown spectroscopy (LIBS) we see a quiet new technology with mobile handheld devices. This technique allows a quick analysis of contained elements in different alloying bases. A focused, pulsed laser removes a small amount of mass and creates a high-temperature micro-plasma on the sample surface. While cooling down, the electrons of different elements leave the excited status and emit characteristic light. This element depending emission is dispersed and detected by a CCD sensor (wavelength range: 220 nm – 480 nm). One advantage of LIBS is the very quick (about 2 seconds) quantification of light element e.g. Al, Mg, Si or even Be and Li.
Both physically completely different techniques quickly analyze the element composition which is compared to an internal, expendable material database resulting in alloy grade suggestion. analyticon offers both handheld technologies in different devices for covering a broad application spectrum and serving very different budgets. During the lecture the different advantages and limitations of both technologies will be discussed.